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Close gaps remaining after linker or adapter ligation
Repair nicked DNA
Optimal for Next Generation Sequencing Applications
The Bst Adapter Fill-In Kit combines the strand displacement polymerase from Bacillus stearothermophilus (Bst) with an optimized buffer containing nucleotides.
Next Generation (NexGen) Sequencing, PCR amplification of damaged DNA, and other applications in molecular biology require that nicks or gaps in DNA be repaired. Ligation of non-phosphorylated adapters (or linkers) in NexGen sequencing leaves a single-strand nick that would prevent subsequent amplification of the internal sequence (see Reference below). The Bst Adapter Fill-In Kit combines the strand displacement polymerase from Bacillus stearothermophilus (Bst) with an optimized buffer containing nucleotides to eliminate nicks and gaps in sample DNA.
Bst Adapter Fill-in of DNA nick created by ligating non-phosphorylated linkers to blunt DNA fragments
Reference:
Margulies, M. et al. (2005) Genome sequencing in microfabricated high-density picolitre reactors. Nature 437, 376380.
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